cystech electronics corp. spec. no. : c335s6 issued date : 2017.01.03 revised date : page no. : 1/6 bas21tw cystek product specification switching diode bas21tw features ? fast switching speed. ? ultra small surface mount package ? high conductance ? pb-free lead plating and halogen-free package equivalent circuit outline bas21tw a anode c cathode sot-363 pin #1 applications ? for general purpose switching applications. ordering information device package shipping BAS21TW-0-T1-G sod-363 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pcs / tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c335s6 issued date : 2017.01.03 revised date : page no. : 2/6 bas21tw cystek product specification absolute maximum ratings @t a =25 parameters symbol min max unit repetitive peak reverse voltage v rrm - 250 v continuous reverse voltage v r - 250 v average rectified forward current (single) i o - 200 ma repetitive peak forward current i fm 400 ma non-repetitive peak forward current @square wave, tj=125 prior to surge t=1ms t=1s i fsm - - 2.5 0.5 a a total power dissipation( note 1 ) ptot 200 mw operating junction temperature range t j -55 +150 c storage temperature range t stg -65 +150 c note 1: device mounted on an fr-4 pcb. electrical characteristics @ tj=25 unless otherwise specified parameters symbol conditions min typ. max unit reverse breakdown voltage v r(br) i r =100 a 250 - - v forward voltage v f i f =100ma i f =200ma - - 1 1.25 v reverse current i r v r =200v - - 100 na diode capacitance cd v r =0v, f=1mhz - - 5 pf reverse recovery time trr i f =i r =30ma, irr=0.1 i r , r l =100 - - 50 ns thermal characteristics symbol parameter conditions value unit rth, j-a thermal resistance from junction to ambient note 1 625 /w note 1: device mounted on an fr-4 pcb.
cystech electronics corp. spec. no. : c335s6 issued date : 2017.01.03 revised date : page no. : 3/6 bas21tw cystek product specification typical characteristics forward current derating curve 0 20 40 60 80 100 120 0 25 50 75 100 125 150 175 200 ambient temperature---t a () percentage of rated forward current---(%) m ounting on glass epoxy pcbs forward current vs forward voltage 0.1 1 10 100 1000 0 0.3 0.6 0.9 1.2 1.5 forward voltage---vf(v) instantaneous forward current---if(ma) pulse width=300s 25c 75c 100c 125c 150c reverse leakage current vs reverse voltage 0.001 0.01 0.1 1 10 100 0 50 100 150 200 250 reverse voltage---vr(v) reverse leakage current---ir(a) 100 75 25 125 150c junction capacitance vs reverse voltage 0.1 1 10 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz
cystech electronics corp. spec. no. : c335s6 issued date : 2017.01.03 revised date : page no. : 4/6 bas21tw cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c335s6 issued date : 2017.01.03 revised date : page no. : 5/6 bas21tw cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : c335s6 issued date : 2017.01.03 revised date : page no. : 6/6 bas21tw cystek product specification sot-363 dimension marking: device code js6 xx date code 6-lead sot-363 plastic surface mounted package cystek package code: s6 style: pin 1. anode1 (a1) pin 2. anode2 (a2) pin 3. anode3 (a3) pin 4. cathode3 (c3) pin 5. cathode2 (c2) pin 6. cathode1 (c1) *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.035 0.043 0.900 1.100 e1 0.085 0.096 2.150 2.450 a1 0.000 0.004 0.000 0.100 e 0.026* 0.650* a2 0.035 0.039 0.900 1.000 e1 0.047 0.055 1.200 1.400 b 0.006 0.014 0.150 0.350 l 0.021 ref 0.525 ref c 0.003 0.006 0.080 0.150 l1 0.010 0.018 0.260 0.460 d 0.079 0.087 2.000 2.200 0 8 0 8 e 0.045 0.053 1.150 1.350 notes : 1 .controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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